HKSTP Tech FYP Sponsorship

The Tech FYP Sponsorship Programme is a new programme by Hong Kong Science and Technology Park (HKSTP), aimed at providing support to final year students to pursue the commercialisation of their final-year project (FYP) or capstone project.

Support provided

• Seed funding of up to HKD100,000: provided by HKSTP based on milestone accomplishment
• Capacity-building resources including but not limited to trainings and workshops in both business management as well as selected technical competencies
• Coaching, mentorship, and network​
• Opportunity to be admitted to the 3-year HKSTP Incubation Programme with up to HKD1.29mil funding support and office space

Eligibility

• Final year students (undergraduate and full-time postgraduate) undertaking final year projects or capstone projects
• Alumni who have recently graduated within 2023 are also welcomed
• Individual with HKID or a HK registered company established for less than 2 years

Evaluation

Projects will be evaluated based on: 

• Business and market potential
• R&D element
• Innovativeness
• Individual or team competency

Application

Application to HKSTP is through nomination by Lingnan University, by way of LEI. 

Submit your application here as well as a pitch deck (template found here). 

The internal submission deadline is on 27 October 2023. 

Shortlisted teams will be invited to a vetting by LEI from 30 October to 1 November 2023. 

Important Dates from HKSTP

For more information, please contact the Programme Coordinator at 2616-8067 (Ms Aka Tsang) or through email at [email protected]